Teledyne FLIR, a division of Teledyne Technologies Incorporated, unveiled the Teledyne FLIR AVP today, marking a significant advancement in video processing technology. This state-of-the-art video processor is set to power the company’s Prism™ AI and computational imaging systems, primarily focusing on applications at the edge of network capabilities.
The AVP is engineered using the latest Qualcomm QCS8550 chip, renowned for its leading-edge performance in mobile, automotive, and robotics technologies. This inclusion positions the AVP as a top-tier artificial intelligence (AI) performer in a market where compact, efficient solutions are increasingly sought after. The processor is designed for seamless integration into a variety of platforms including unmanned aerial vehicles (UAVs), robotics, small gimbals, handheld devices, and fixed-mounted security systems.
One of the standout features of the AVP is its compatibility with Teledyne FLIR’s Prism AI and Image Signal Processing (ISP) software libraries. It interfaces effectively with both Boson® and Neutrino® thermal infrared imaging camera modules, as well as a wide array of popular visible cameras. The Prism AI, a sophisticated perception software, is trained on an extensive thermal image data set with over 5 million annotations. It is adept at detecting, classifying, and tracking objects or targets across a range of applications from automotive autonomy to perimeter security.
According to Dan Walker, Vice President of Product Management at Teledyne FLIR, "The new AVP is the most powerful and SWaP-optimized processor on the market today, running AI workloads up to five times faster than competitive offerings." This enhancement is crucial for applications requiring rapid and accurate decision-making capabilities, such as in counter-drone systems and ground intelligence.
In addition to its robust processing power, the AVP supports a range of development tools designed to streamline the product development process. These include the Qualcomm RB5 development kit and various software and board-support packages, which help developers design and fabricate custom interface boards tailored to specific product requirements.
The launch of the AVP not only promises enhanced capabilities in electro-optical systems but also simplifies the development process and minimizes integration risks, allowing developers to push the boundaries of what is possible in edge computing.
For those interested in witnessing the capabilities of the new AVP firsthand, Teledyne FLIR will be showcasing the technology at the SPIE Defense + Commercial Sensing Exhibition, taking place from April 23 through April 25, 2024, at booth #702.
For further details, please visit the Teledyne FLIR website: https://www.flir.com
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